Smiths Interconnect offers a wide range of spring contacts and design standards for high quality test sockets providing flexibility and fast delivery for optimal cost/performance ratio.
In-house capabilities encompass design, development, manufacturing and testing. Providing operational excellence tailored to volume manufacturing requirements, global sourcing, world class engineering talent and rapid prototyping.
We foster a Culture of Quality to be the best at what we do ... Quality, it is all about the Customer.
Highly precised top and bottom array simultaneous test capable socket for effective package on package test. Customized socket design is capable to test high speed signals in lab, engineering, SLT and ATE applications. Controlled impedance loop-back with PCB for high speed signal integrity.
IC developers are increasingly integrating functionalities within a single package, escalating the complexity of test. Higher speed digital and analog devices are being manufactured at record volumes and the need for high performance testing has never been greater. The DaVinci Series Test Socket is a high performance coaxial socket developed for reliable IC testing up to 67GHz Analog RF & 56Gbps NRZ Digital, a patented design integrating spring probe technology and a proprietary insulated housing material.
Customized test sockets for any IC packages. Suitable for lab, Engineering, SLT & ATE test application. Wide selection of Smiths Interconnects spring pins with low and stable contact resistance. World class design, Lab and manufacturing facility to ensure consistence product performance with highest customer satisfaction. Highly competitive price and global support.
Highly reliable multi site strip test socket . Customized design to suite any strip test handler. High parallelism offers higher throughput.
5A continues current carrying capacity and capable -50 to 170deg C test environment. Proprietary contact design with wiping action at device pad to ensure consistent contact resistance. Minimal scrub action to the PCB pad.
Extremely short signal path and capable to handle >40GHz. Customized test socket design for lab, engineering, SLT and ATE tests.
Smiths Interconnect offers high value Thermal Management Lid capabilities including air-chilled or liquid cooled technology, capable of dissipating up to 650 Watts. Our solutions are developed to be compatible with existing test hardware footprints for simple integration, reducing test set-up time and overall cost.
Smiths Interconnect is a leading provider of technically differentiated electronic components, subsystems, microwave and radio frequency products that connect, protect and control critical applications in the commercial aviation, defense, space, medical, rail, semiconductor test, wireless telecommunications, and industrial markets.