Spring probes are designed to optimize performance in high reliability, multicycle applications. Smiths Interconnect's spring probes, featuring IDI contact technology, are compliant which makes them ideal for blind mate applications as they self correct for x, y, z, rotational and angular misalignment of the target. Offered in compressed heights less than 2 mm and utilized on pitches as tight as 0.4 mm, they are well suited for high density, board-to-board, battery contact and high frequency applications.
Spring probes featuring IDI technology are designed to optimize performance in high reliability, multicycle applications. Spring probes are compliant which makes them ideal for blind mate applications as they selfcorrect for x, y, z, rotational and angular misalignment of the target.
Featuring Spring Probe technology utilized in custom connector designs. Mixed signals and functionality can be designed into a single connector.
Dovetail connector Series features C Series Probes, renowned for their incomparable shock and vibration performance, housed in a patent pending block design. These connectors make it easy to explore the benefits of spring probe technology without the investment associated with custom tooling.
Spring probe techology utilized in custom connector designs. Mixed signals and functionality can be designed into a single connector.
Spring probes provide reliable electro-mechanical performance through hundreds of thousands of cycles. They are available in a variety of sizes, spring forces and terminations. Smiths Interconnect compression mount connectors utilizing spring probe technology offer tremendous advantages in reliability, performance and efficiency in comparison to conventional technologies like stamped metal, wire mesh, pin-and-socket or elastomer.
Smiths Interconnect is a leading provider of technically differentiated electronic components, subsystems, microwave and radio frequency products that connect, protect and control critical applications in the commercial aviation, defense, space, medical, rail, semiconductor test, wireless telecommunications, and industrial markets.