Smiths Interconnect offers a broad range PCB connectors for harsh environments. A wide choice of configurations and terminations of signal, power, high speed, RF contacts and spring probes solutions.
In-house capabilities encompass design, development, manufacturing and testing. Providing operational excellence tailored to volume manufacturing requirements, global sourcing, world class engineering talent and rapid prototyping.
Hyperboloid is the original superior performing contact technology for use in demanding environments where reliability and safety are critical.
Smiths Interconnect's cPCI Series offers extremely high reliability in a cPCI standard envelope.
Smiths Interconnect’s SpaceNXT™ Aurora Series, the first COTS Plus 2mm Hard Metric backplane connector, tested and qualified to ESA ESCC 3401 specifications. The SpaceNXT™ Aurora connectors have gone through extensive qualification testing to ESA ESCC 3401 specifications in order to validate today’s rigorous application requirements per customer and industry.
Smiths Interconnect's C9394 series is a high density, line removable module (LRM) connector available in 132 through 594 positions, that can be configured to include fiber optic and coax options.
Smiths Interconnect's versatile, high density CMD connector solution for board to board and wire to board with built in coding and keying as well as ESA qualification
The benefits of Smiths Interconnect's spring probe technology specifically designed for your application.
Smiths Interconnect's spring probes featuring IDI contact technology are specifically designed for your application.
Dovetail connector Series features C Series Probes, renowned for their incomparable shock and vibration performance, housed in a patent pending block design. These connectors make it easy to explore the benefits of spring probe technology without the investment associated with custom tooling.
The HDLP Series is a high density, lightweight signal connector specifically designed for applications where space and weight is at a premium for board to board interconnections. The HDLP series of rectangular PCB connectors meets the requirement of space-constrained applications that require low mating force, a high number of mating cycles, low and stable contact resistance, and excellent fretting corrosion resistance.
Smiths Interconnect's HPH series is a high density interconnect available up to 303 contacts with multiple hardware choices and backpotting option.
Smiths Interconnect's HPW series is a versatile interconnect with mixed signal and power contacts, up to 15A each
Smiths Interconnect's KMC series is an ESA qualified, high density board to board and board to wire interconnect available in multiple configurations from 26 to 162 positions
KVPX Series is an embedded interconnect system that provides unrivaled performance in harsh environments while adapting to the VITA standard design requirements. KVPX Series is a shielded, high-density, high-speed, modular interconnect system optimized for differential pair architectures on a 1.8mm x 1.35mm grid.
MHD/MDD/MDP series is an ESA qualified, high density board to board and board to wire interconnect available in up to 400 positions, with available insulators to accommodate coax and power contacts.
High reliability MIL-DTL-55302 compliant connectors offer mixed signal, power and coaxial contacts designed for defense, commercial aerospace and space demanding applications
Smiths Interconnect's RBA series is a rugged stick header that can be cut to sizes up to 27 positions.
HyperStac RX Series is a Z axis interconnection solution designed for all types of micro-electronics applications requiring reliable and compact packaging solutions. The Hyperstac RX Series meets the needs of the Defence, Avionics and Space electronics applications.
Smiths Interconnect is a leading provider of technically differentiated electronic components, subsystems, microwave and radio frequency products that connect, protect and control critical applications in the commercial aviation, defense, space, medical, rail, semiconductor test, wireless telecommunications, and industrial markets.