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International Wafer Level Packaging Conference

IWLPC  is now in its 17th successful year as a well-established international conference, boasting annual representation from over 19 countries. The technical program and exhibition focus on semiconductor packaging and advanced wafer-level packaging technology featuring 3 tracks in WLP, 3D Integration, and Advanced Manufacturing and Test. This year is a continuation of Bridging the Boundaries: Wafer, Panel and Beyond  reflecting the enablement of 5G communications, AI, and IoT, automotive and more.

 Register before September 15th to receive a discounted rate.

Register Today


Technical Program: October 13-30, 2020 

October 13 at 9:00am PST: Keynote Presentation: Dan Oh, Ph.D,  Samsung Electronics. 

October 13-30: On-demand technical presentations will be available to access.

October 14: LIVE panel discussion and Q&A session will be streamed.

The panel discussion will be available to view until October 30th. 

Attend a LIVE Professional Development Course! 

PDC1: Polymers in Wafer Level Packaging

Tuesday, October 27, 2020

8:30am-12:00pm (US Pacific)

Instructor: Jeff Gotro, Innocentrix, LLC


PDC2: From Wafer to Panel Level Packaging

Thursday, October 29, 2020

8:30am-12:00pm (US Pacific)

Instructors: Tanja Braun, Ph.D. & Michael Topper, Fraunhofer IZM

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